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AIN wafer

Product Detail Information

Polished ceramic substrate: Our AlN  substrate can be polished(single and double polish) by the advanced machine which imported from abroad. Ceramic substrate surface roughness can reach to less than 0.025um without porous after being polished. It is perfectly suitable for the device application of small spec, high precision , wiring density and  good stability.


Laser processing service: Through laser machine scribing, cutting, and drilling, we can process  AlN  substrate with high accuracy and absolute consistency upon customer’s request.


Regular specification of AIN wafer                                                             

Square pieces

Thickness: 0.385mm/0.5mm/0.635mm/1mm                           

Length/wide: 50.8mm/76.2mm/101.6mm/114.3mm                        

Round pieces

Thickness: 1mm, 1.2mm, 1.5mm, 2mm, 2.5mm               

Diameter: 16/19mm, 20/26mm, 30/35mm, 40/45mm, 50/52mm, 60mm, 75mm, 80mm

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